基本信息
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Bio
Peter J. Zampardi (Senior Member, IEEE) received the B.E. degree in engineering physics from Stevens Institute of Technology, Hoboken, NJ, USA, in 1986, the M.S. degree in applied physics from California Institute of Technology, Pasadena, CA, USA, in 1988, and the Ph.D. degree in quantum electronics from the University of California at Los Angeles, Los Angeles, CA, USA, in 1997.
From 1986 to 1990, he worked on optics, investigating materials for visible light emitters, modeling and testing optical gyroscopes, and developing/characterizing optical filters. From 1990 to 1998, he focused on high-speed devices, high-speed circuit development, characterization, and modeling in various technologies (HBT, HEMT, and RTD). In 1999, he led the technical development of SiGe RF models for AMS Foundry at IBM, Burlington, VT, USA. From 2000 to 2012, he worked at PA Technologies, Cincinnati, OH, USA, where he led the device design, modeling, and characterization of all aspects of SWKS Newbury Park Technologies: from epi-design to circuit design support and technology comparisons. He joined Qorvo (formerly RFMD), Newbury Park, CA, USA, in 2013, where his responsibilities include serving as an interface between the design community and technology development teams and supporting advancements in technology, device design, modeling, technology development and characterization, design-kits, and ESD solutions. He is currently a Technical Fellow at the GaAs & Si Research and Development Department, Qorvo. He has authored or coauthored four book chapters and over 200 papers related to devices, circuits, and modeling. He currently holds 56 U.S. patents.
Dr. Zampardi has been an active participant on executive and technical committees of BCICTS [the merger of the Compound Semiconductor Integrated Circuits Symposium (CSICS) and the Bipolar/BiCMOS Circuits and Technology Meeting (BCTM)], IMS, and the MTT-12 Technical Committee.
Research Interests
Papers共 190 篇Author StatisticsCo-AuthorSimilar Experts
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期刊级别
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PRIMEpp.9-12, (2023)
ELECTRONICSno. 16 (2023): 3471-3471
IEEE Microwave Magazineno. 5 (2023): 80-82
2023 29TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINICpp.1-5, (2023)
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)pp.1-7, (2022)
2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)pp.1-7, (2021)
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Author Statistics
#Papers: 181
#Citation: 2785
H-Index: 25
G-Index: 39
Sociability: 6
Diversity: 1
Activity: 0
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