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Research Interests

Papers共 21 篇Author StatisticsCo-AuthorSimilar Experts

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Low-Temperature Area-Selective Metal Passivation Bonding Platform for Heterogeneous Integration
Mu-Ping Hsu, Wen-Tsu Tsai, Chi-Yu Chen, Tzu-Ying Kuo,Ou-Hsiang Lee,Hsiang-Hung Chang,Kuan-Neng Chen
IEEE Electron Device Lettersno. 99 (2024): 1-1
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Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer Base Adhesive
Tsung- Yu Ouyang,Yu-Min Lin, Yu-Ping Chan,Ou-Hsiang. Lee,Ching-Kuan Lee,Hsiang-Hung Chang, Chin-Hung Wang,Wei-Chung Lo, Po- Yao Chuang, Ying-Chung Tseng, Po-Hao Tsai, Michael Gallagher,
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)pp.1-2, (2024)
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Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocrystalline Cu/SiO2 Chip-on-Wafer Hybrid Bonding for 3D Chip Integration
Ang-Ying Lin,Yu-Min Lin,Chun-Lin Lu, Hsin-Yi Liao, Chen-Chun Yu,Ou-Hsiang Lee, Tsung-Chieh Chiu,Wei-Lan Chiu,Hsiang-Hung Chang,Shou-Zen Chang
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)pp.1-2, (2024)
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Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Prebond for Cu/Polymer Hybrid Bonding
Chia-Hsin Lee, Chung-An Tan,Michelle Fowler,Ting-Yu Ko,Yu-Min Lin,Wei-Lan Chiu,Ou-Hsiang Lee,Kuan-Neng Chen
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 8 (2023): 1316-1323
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Low Temperature and Fine Pitch Nanocrystalline Cu/SiCN Wafer-to-Wafer Hybrid Bonding
Wei-Lan Chiu,Ou-Hsiang Lee,Tzu-Ying Kuo, James Yi-Jen Lo,Chiang-Lin Shih,Hsih-Yang Chiu,Hsiang-Hung Chang
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1105-1109, (2023)
Cited2Views0EIWOSBibtex
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A Novel Polymer-Based Ultra-High Density Bonding Interconnection
Yu-Min Lin,Tsung-Yu Ou Yang,Ou-Hsiang Lee,Ching-Kuan Lee, Hsiu-Kuei Ko, Yi-Shu Chen,Hsiang-Hung Chang,Michael Gallagher,Christopher Gilmore, Po-Yao Chuang, Ying-Chung Tseng, Po-Hao Tsai,
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1779-1784, (2023)
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