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Papers共 26 篇Author StatisticsCo-AuthorSimilar Experts

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Nanoindentation Based Methodology to Characterize the Adhesion Strength of Dielectric Bond Interfaces
Kris Vanstreels,Oguzhan Orkut Okudur, Yusuf Burak Ozdemir,Mario Gonzalez,Eric Beyne
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)pp.1-7, (2025)
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Wafer-to-Wafer Bonding with Saddle-Shaped Wafers
Shuo Kang, Serena Iacovo, Koen D’havé,Oguzhan Orkut Okudur, Anton Alexeev,Thomas Plach,Gernot Probst, Taotao Ding,Markus Wimplinger,Thomas Uhrmann, Joeri De Vos,Gerald Beyer,Eric Beyne
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)pp.2001-2006, (2025)
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Mitigation of Wafer-To-Wafer Bonding Distortions Through Accelerated Simulations and Measurements
Oguzhan Orkut Okudur, Serena Iacovo, Shuo Kang, Deewakar Sharma,Mario Gonzalez,Eric Beyne
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)pp.1650-1655, (2025)
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Simulation-Driven Insights into Nanoindentationbased Adhesion Strength Measurement of Wafer-to-Wafer Bonds
Yusuf Burak Ozdemir,Oguzhan Orkut Okudur,Kris Vanstreels,Mario Gonzalez,Clement Merckling
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2025)
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Mechanical Strength Assessment of Ruthenium Nano-Interconnects with Airgaps Using Wedge Indentation
Yao,Kris Vanstreels,Abdellah Salahouelhadj,Oguzhan Orkut Okudur,Mario Gonzalez
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2025)
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Methodologies for Characterization of W2W Bonding Strength
Mario Gonzalez,Kris Vanstreels,Oguzhan Orkut Okudur,Serena Iacovo,Eric Beyne
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.790-797, (2024)
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Simulations of Wafer-to-Wafer Bonding Dynamics and Deformation Mechanisms
Oguzhan Orkut Okudur,Serena Iacovo,Shuo Kang,Mario Gonzalez,Eric Beyne
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)pp.1-5, (2024)
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Predictive Modeling of Thin Film Yield Stress Using Machine Learning: A Simulation-Based Approach
Yusuf B. Ozdemir,Oguzhan Orkut Okudur,Mario Gonzalez,Clement Merckling
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2024)
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Author Statistics

#Papers: 23

#Citation: 255

H-Index: 7

G-Index: 15

Sociability: 4

Diversity: 2

Activity: 3

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