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Papers共 13 篇Author StatisticsCo-AuthorSimilar Experts
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2023 7TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTMpp.1-3, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1332-1338, (2023)
Tanja Braun,Thi Huyen Le,Marco Rossi,Ivan Ndip,Ole Hoelck,Karl-Friedrich Becker,Mathias Boettcher,Michael Schiffer,Rolf Aschenbrenner, Friedrich Mueller, Marcus Voitel,Martin Schneider-Ramelow,
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.2009-2015, (2021)
T. Braun,M. Schneider-Ramelow,K.-D. Lang,K.-F. Becker,O. Hoelck,S. Voges, L. Boettcher, M. Topper, L. Stobbe,R. Aschenbrenner, M. Voitel
International Symposium on Microelectronicsno. 1 (2019): 000568-000572
T Braun,K. -F. Becker,O. Hoelck, S. Voges, M. Woehrmann, L. Boettcher, M. Toepper, L. Stobbe,R. Aschenbrenner, M. Schneider-Ramelow, K. -D. Lang
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)pp.9-9, (2019)
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