基本信息
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Bio
Boyuan Cui was born in Ningxia, China, in 2000. He is currently working toward the B.S. degree in electrical engineering with North China Electric Power University, Beijing, China.
His current research interests include circuit design of modular multilevel converter for high voltage direct current system.
Research Interests
Papers共 71 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE Transactions on Dielectrics and Electrical Insulationno. 99 (2024): 1-1
2023 IEEE 4th International Conference on Electrical Materials and Power Equipment (ICEMPE)pp.1-4, (2023)
2023 IEEE 4th International Conference on Electrical Materials and Power Equipment (ICEMPE)pp.1-4, (2023)
2023 IEEE 4th International Conference on Electrical Materials and Power Equipment (ICEMPE)pp.1-4, (2023)
2022 IEEE International Conference on High Voltage Engineering and Applications (ICHVE)pp.1-4, (2022)
2022 IEEE 4th International Conference on Dielectrics (ICD)pp.257-260, (2022)
Thermosetting Resinno. 6 (2022)
2022 IEEE International Conference on High Voltage Engineering and Applications (ICHVE)pp.1-4, (2022)
2022 IEEE 4th International Conference on Dielectrics (ICD)pp.643-646, (2022)
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