Muhannad S Bakir (Muhannad Bakir) - School of Electrical and Computer Engineering, College of Engineering, Georgia Institute of Technology

基本信息

Career Trajectory

Bio

Dr. Bakir is currently the Dan Fielder Professor in the School of Electrical and Computer Engineering at Georgia Tech. He is the recipient of the 2013 Intel Early Career Faculty Honor Award, 2012 DARPA Young Faculty Award, 2011 IEEE CPMT Society Outstanding Young Engineer Award, and was an Invited participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium. In 2015, Dr. Bakir was elected by the IEEE CPMT Society to serve as a distinguished lecturer for a four-year term.

Research Interests

Papers共 244 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选

Multi-Chiplet Implementation of a Replaceable Integrated Chiplet (PINCH) Assembly

Michael A. Nieves Calderon, Shane Oh, Jonathan R. Brescia,Muhannad S. Bakir

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 3 (2024): 529-532

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Electrical Characterization of Shielded TSVs With Airgap Isolation for RF/mmWave Applications

Shane Oh,Ting Zheng,Muhannad S. Bakir

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 2 (2024): 202-210

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Co Metal ALD on Cu with Cyclic Clean by Peroxide and Hydrazine for Inverse Hybrid Metal Bonding

Cheng-Hsuan Kuo, Dipayan Pal,Victor Wang,Madison Manley, Rohan Sahay, Ravindra Kanjolia, Mansour Moinpour, Jacob Woodruff,Bakir Muhannad, Jeff Spiegelman,Andrew C. Kummel

2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)pp.1-2, (2024)

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Inverse Hybrid Bonding with Metal Oxide Framework as Infill for Heterogeneous Integration

Rohan Sahay, Dipayan Pal, Ashita Victor, Cheng-Hsuan Kuo, Madison Manley, Harsono Simka, Andy Kummel,Muhannad Bakir

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1837-1840, (2024)

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Electrical Characterization of Shielded TSVs with Airgap Isolation for RF/mmWave Applications

Shane Oh,Ting Zheng,Muhannad S. Bakir

IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1

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Design and Thermal Analysis of 2.5D and 3-D Integrated System of a CMOS Image Sensor and a Sparsity-Aware Accelerator for Autonomous Driving

Janak Sharda,Madison Manley,Ankit Kaul,Wantong Li,Muhannad Bakir,Shimeng Yu

IEEE Journal of the Electron Devices Society (2024): 426-432

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Design Space Exploration for Power Delivery Network in Next Generation 3D Heterogeneous Integration Architectures

Madison Manley, Ankit Kaul,Muhannad S. Bakir

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.2223-2228, (2024)

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Design and Thermal Analysis of 2.5D and 3D Integrated System of a CMOS Image Sensor and a Sparsity-Aware Accelerator for Autonomous Driving

Janak Sharda,Madison Manley,Ankit Kaul,Wantong Li,Muhannad Bakir,Shimeng Yu

IEEE Journal of the Electron Devices Societyno. 99 (2024): 1-1

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Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density

Euichul Chung, Geyu Yan, Bharath Ramakrishnan,Husam Alissa, Vaidehi Oruganti, Christian Belady, Erik W. Masselink,Muhannad S. Bakir

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1479-1484, (2024)

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Scalable Fiber-Array-to-Chip Interconnections with Sub-Micron Alignment Accuracy

Shengtao Yu,Thomas K. Gaylord,Muhannad S. Bakir

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.748-752, (2023)

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