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Bio
Muhammad Ali (Student Member, IEEE) received the bachelor’s degree in electrical engineering degree from the National University of Science and Technology (NUST), Rawalpindi, Pakistan, in 2013, and the M.Sc. and Ph.D. degrees in electrical and computer engineering (ECE) from the Georgia Institute of Technology, Atlanta, GA, USA, in 2017 and 2020, respectively.
He is now with Apple Inc., Cupertino, CA, USA. From 2016 to 2020, he was a Graduate Research Assistant (GRA) with the 3D Systems Packaging Research Center (PRC), Georgia Institute of Technology, advised by Prof. Rao R. Tummala. As a GRA at Georgia Tech PRC, he was working on modeling, design, fabrication, and characterization of miniaturized, high-performance passive components for 5G and millimeter-wave (mm-wave) applications on ultrathin glass substrates. His research interests include RF/mm-wave passive component design and fabrication, electronic systems packaging, and system performance analysis techniques.
Dr. Ali was a recipient of the prestigious Fulbright Scholarship for the term 2015–2017 and the Best Student Paper Award at the Future Car Workshop in 2017 by IEEE, SEMI, CPMT, iMAPS, and iNEMI. He received the Intel Best Student Paper Award at the IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, in 2018, and the ECTC Student Travel Award sponsored by the IEEE Electronics Packaging Society (EPS) in 2019.
Research Interests
Papers共 17 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 4 (2021): 708-711
Takenori Kakutani,Yuya Suzuki,Meiten Koh,Shoya Sekiguchi, Satoko Matsumura, Kota Oki,Shoko Mishima,Nobuhiro Ishikawa,Toshiyuki Ogata,Serhat Erdogan,Muhammad Ali,Mohanalingam Kathaperumal,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.538-543, (2021)
International Symposium on Microelectronicsno. 1 (2020): 000201-000205
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2020): 1515-1523
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