基本信息
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Bio
Moritz Brunion received the bachelor’s and master’s degrees in electrical and computer engineering from the University of Bremen, Bremen, Germany, in 2019 and 2022, respectively.
He is currently a Researcher with IMEC, Leuven, Belgium. His current research interests focus on technology-driven interconnect architecture design.
Research Interests
Papers共 14 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE International Reliability Physics Symposiumpp.8B.4-1-8B.4-8, (2024)
IEEE International Reliability Physics Symposiumpp.1-6, (2024)
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMSno. 12 (2023): 1-9
Mohamed Naeim,Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser,Giuliano Sisto,Moritz Brunion,Rongmei Chen,Geert Van der Plas,Eric Beyne,Dragomir Milojevic
2023 IEEE International 3D Systems Integration Conference (3DIC)pp.1-4, (2023)
Mohamed Naeim,Hanqi Yang, Pinhong Chen, Rong Bao, Antione Dekeyser,Giuliano Sisto,Moritz Brunion,Rongmei Chen,Geert Van der Plas, Erik Beyne,Dragomir Milojevic
2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC (2023)
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IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systemsno. 99 (2023): 1-1
IRPSpp.1-7, (2023)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 3 (2023): 300-314
ISPD '23: Proceedings of the 2023 International Symposium on Physical Designno. 99 (2023): 62-70
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