基本信息
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个人简介
Ming Shen (Senior Member, IEEE) was born in Yuxi, China. He received the M.Sc. degree in electrical engineering from the University of Chinese Academy of Sciences (UCAS), Beijing, China, in 2005, and the Ph.D. degree in wireless communications from Aalborg University, Aalborg, Denmark, in 2010, with the Spar Nord Annual Best Thesis Nomination.
He is currently an Associate Professor in RF and mm-wave circuits and systems with the Department of Electronic Systems, Aalborg University. He has 20 years of experience in RF and millimeter-wave circuits and systems, including 12 years of experience in CMOS RF/mixed-signal IC design. He is also the Grant Holder and PI of two Danish national research projects and the Management Committee Member Substitute from Denmark in the EU COST Action IC1301 with the aim to gather international efforts and address efficient wireless power transmission technologies. His current research interests include circuits and antennas for 5G and satellite communications, low-power CMOS RF and millimeter-wave circuits and systems, circuits and systems for biomedical imaging, and artificial intelligence.
Dr. Shen is a TPC Member of IEEE Nordic Circuits and Systems Conference (NORCAS). He also serves as a reviewer for IEEE and Kluwer.
研究兴趣
论文共 138 篇作者统计合作学者相似作者
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IEEE Transactions on Antennas and Propagationno. 99 (2024): 1-1
Peng Wang,Zhenning Li,Chao Luo,Zhaohui Wei, Tong Wu,Wen Jiang,Tao Hong, Naser Ojaroudi Parchi,Gert Frølund Pedersen,Ming Shen
IEEE Transactions on Antennas and Propagationno. 99 (2024): 1-1
Journal of experimental orthopaedicsno. 3 (2024): e12048-e12048
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUESno. 2 (2024): 996-1007
IEEE transactions on artificial intelligenceno. 2 (2024): 516-529
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATIONno. 2 (2024): 1319-1328
IEEE Transactions on Antennas and Propagationno. 99 (2024): 1-1
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUESno. 3 (2024): 1467-1479
IEEE Transactions on Aerospace and Electronic Systemsno. 99 (2024): 1-22
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT (2024): 1-15
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