基本信息
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Bio
Michael R. Scheuermann received the Ph.D. degree in physics from Wayne State University, Detroit, MI, USA, in 1983.
He then joined IBM T. J. Watson Research Center, Yorktown Heights, NY, USA, studying electrical and optical properties of superconducting films. In 1985, he joined the VLSI Test and Measurement Group, where he worked on picosecond opto-electronics and developed a high-bandwidth probe for testing high pin count integrated circuits. In 1995, he joined the VLSI Design Group, where he was responsible for the L2 integration on the POWER4 and POWER5 microprocessors. He then served as the lead integrator for the POWER6 core. Subsequently, he worked on the high-level design for the Series P and BlueGeneQ microprocessors and 3-D integration for high-performance systems. Recently, he has been working on integration and power analysis for next-generation artificial intelligence (AI) computer chips. He has coauthored more than 49 technical articles. He holds 11 U.S. patents.
Dr. Scheuermann received various awards at IBM, including the Research Division Award, eight Outstanding Technical Achievement Awards, and four Invention Achievement Awards.
Research Interests
Papers共 10 篇Author StatisticsCo-AuthorSimilar Experts
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Proceedings of the IEEEno. 12 (2020): 2232-2250
IEEE Solid-State Circuits Lettersno. 12 (2018): 217-220
David Wolpert,Erwin Behnen,Leon J. Sigal,Yuen H. Chan,Gustavo Enrique Téllez, Douglas Bradley,Richard E. Serton, Rajesh Veerabhadraiah, William Ansley,Andrew Bianchi,Nagu Dhanwada,Sungjae Lee,
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