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个人简介
Michael Andrew Cracraft (S’98–M’08) received the
B.S. (summa cum laude), M.S., and Ph.D. degrees in electrical engineering from the Missouri
University of Science and Technology (formerly the University of Missouri–Rolla), Rolla, MO, USA, in 2000, 2002,
and 2007, respectively.
He received an NSF IGERT fellowship while working with the Electromagnetic Compatibility Laboratory, Missouri
University of Science and Technology, as a Graduate Student. Since 2007, he has been working in packaging and signal
integrity on power systems and system Z for IBM, Poughkeepsie, NY, USA. He specializes in high-speed and
high-frequency measurements, electromagnetic modeling, and model-to-hardware correlation.
研究兴趣
论文共 40 篇作者统计合作学者相似作者
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2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposiumpp.967-972, (2021)
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)pp.379-384, (2018)
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)pp.234-237, (2018)
Yujie He,Zach Silva, Zach Bergstedt,Joseph Faia, Shelby Van Hoosier,Sang Goo Kang, Garrett Shaffer,Edward Wheeler,Michael Cracraft
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作者统计
#Papers: 40
#Citation: 467
H-Index: 14
G-Index: 20
Sociability: 5
Diversity: 1
Activity: 0
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