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个人简介
Matthew R. Lueck received the B.S. degree in electrical engineering from the University of Cincinnati, Cincinnati, OH, in 2002, and the M.S. degree in electrical engineering from The Ohio State University, Columbus, in 2005.
Since joining the Center for Materials and Electronic Technologies, RTI International, Research Triangle Park, NC, as a Research Engineer in 2005, he has been involved with various processes for 3-D integrated electronics including TSV interconnects, electroplating, thin wafer handling, and fine pitch metal bonding. He has also developed processes for the microfabrication of vacuum electronics for terahertz sources. He has authored or coauthored 40 scientific publications.
研究兴趣
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Josephine Chang,Ryan Walsh, Fadi Afiouni,Thomas Spence, Nicholas Edwards,Kieran Perkins, Sean McLoughlin,Matthew Lueck,Jennifer Ovental,Dean Malta,Charles F. Campbell,Deep Dumka,
2022 IEEE International Symposium on Phased Array Systems & Technology (PAST)pp.1-4, (2022)
Dean Malta,Erik Vick,Matthew Lueck,Alan Huffman,Sharon Woodruff,Parrish Ralston,Jeffrey Hartman,Nathan Bushyager, G. David Ebner, Stuart Quade,Adam Young,Christopher Hillman,
International Symposium on Microelectronicsno. 1 (2015): 000028-000035
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (2015)
Low Temperature Bonding for 3D Integrationpp.7-7, (2014)
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作者统计
#Papers: 60
#Citation: 990
H-Index: 20
G-Index: 29
Sociability: 5
Diversity: 2
Activity: 0
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