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个人简介
Martin Rack received the M.S. degree in electrical engineering from the Université Catholique de Louvain, Louvain-la-Neuve, Belgium, in 2014, where he is currently pursuing the Ph.D. degree.
His current research interests include small- and large-signal modeling of RF CMOS devices and semiconductor substrates, and their characterization and optimization toward successful monolithic integration of RF devices using silicon-based technology.
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IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERSno. 3 (2024): 298-301
Massinissa Nabet,Martin Rack,Benjamin Huet,Romain Tuyaerts,Gilles Scheen, Ling Yan Zhang,Arthur Emiel,Clément Dorion,Pierre Blondy, Romain Stefanini,Jean-Pierre Raskin
2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)pp.1-4, (2023)
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L. Nyssens,M. Rack,M. Nabet,C. Schwan, Z. Zhao,S. Lehmann, T. Herrmann, D. Henke,A. Kondrat, C. Soonekindt,F. Koch, T. Kache,
Solid-State Electronics (2023): 108656-108656
2023 21st IEEE Interregional NEWCAS Conference (NEWCAS)pp.1-5, (2023)
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IEEE TRANSACTIONS ON ELECTRON DEVICES (2023)
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River Publishers eBookspp.127-142, (2023)
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IEEE Transactions on Electron Devicesno. 10 (2023): 4987-4992
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2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)pp.1-4, (2023)
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2023 18TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE, EUMICpp.313-316, (2023)
IEEE Journal of the Electron Devices Society (2023): 650-657
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