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Research Interests

Papers共 211 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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Direct-Write NiO RRAM Cells
Jordan Howard-Jennings,Riadh Al-Haidari,Emuobosan Enakerakpo,Abdullah Obeidat, Kevin Bell, Tom Rovere,Stephen Gonya,Mohammed Alhendi,Mark Poliks
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.704-709, (2024)
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Development of a Reusable Smart-Catheter System for Improved Urinary Health Monitoring
Zhi Dou, WT Al-Shaibani, Erika Solano Diaz,Mohammed Alhendi,Riadh Al-Haidari,Abdullah Obeidat, Mark J. Schadt,Mark Poliks, Daniel Wollin, Souvik Paul, Kara Allanach
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.2117-2124, (2024)
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Evaluation of Materials for the Design and Development of Sustainable Low-Cost Single-Use Electrode Leads for Wearable Medical Devices
Babatunde Falola,Riadh Al-Haidari, Olya Noruz Shamsian,Udara Somarathna, Bryan Cabrera, Cameron Cretaro,Mohammed Alhendi,Mark Poliks,Gurvinder Singh Khinda,Nancy Stoffel,Tzu-Jen Kao, Rafael Tudela
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.179-186, (2024)
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Embedded RF Packaging Via Ceramic 3D Printing and Printed Electronics Additive Manufacturing
Abdullah S. Obeidat,Ashraf Umar, Zhi Dou,Firas Alshatnawi,Riadh Al-Haidari, Waleed Al-Shaibani,Mohammed Alhendi,Mohamed Y. Abdelatty, Linda Boyd,Cathleen Hoel, Genaro Soto Valle Angulo, Thomas Budka,
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.685-692, (2024)
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Embedded PIN-Diode Die Interconnections with Aerosol-Jet Printing
Stephen Gonya,Mohammed Alhendi,Emuobosan Enakerakpo,Mark D. Poliks, Tom Rovere, Joseph Jendrisak, Michael Geyer,Daniel Hines
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
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Conformal Dry Electrode for ECG Monitoring
Riadh Al-Haidari, Babatunde Falola,Mohammed Alhendi, Mark J. Schadt,Mark Poliks, Daniel Balder, Andrew Stemmermann, Matthew Foster, Veerendra Balchand,Tzu-Jen Kao,Nancy Stoffel
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1662-1669, (2024)
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