基本信息
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Bio
Mike Roellig received the Diploma degree in electrical engineering (M.S. degree in engineering) and the Ph.D. degree in materials science and engineering, with his work on material property measurement of lead-free solders, from Dresden University of Technology, Dresden, Germany.
After he received his Diploma, he worked in the fields of electronics technology, microsystems technology, and packaging and material characterization. He is currently with the Fraunhofer Institute for Nondestructive Testing (IZFP), Dresden, where he is the Head of the Department of Test and Diagnosis Methods. His scientific field is concentrated to electronics packaging material characterization, reliability of microsystems, and finite-element simulations. His responsibility spans over development of advanced optical diagnosis techniques and development of miniaturized and reliable optical spectrometer devices for structure integrated or mobile diagnostics.
Research Interests
Papers共 98 篇Author StatisticsCo-AuthorSimilar Experts
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-9, (2024)
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2024)
Power Electronic Devices and Components (2023): 100040-100040
e-Prime: Advances in Electrical Engineering, Electronics and Energy (2023): 100166-100166
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2022)
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2022)
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2022)
2022 45th International Spring Seminar on Electronics Technology (ISSE)pp.1-8, (2022)
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-10, (2022)
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Author Statistics
#Papers: 51
#Citation: 498
H-Index: 11
G-Index: 20
Sociability: 5
Diversity: 2
Activity: 0
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