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个人简介
Ming-Hsien Lin received the Ph.D. degree in electronics engineering from National Chiao-Tung University, Hsinchu, Taiwan. He had been with United Microelectronics Corporation, as a Reliability Engineer. He joined TSMC in 2006, as a Technical Manager with Technology Reliability Physics Department. He involves with the International Reliability Physics Symposium, serving as the Metallization and BEOL reliability Committee of the Symposium. He has over 30 publications on reliability and superconductivity. He interests mechanisms of Cu electromigration, BEOL local heat effect, and chip-level reliability. He received the IRPS Best Paper Award in 2014. He served as a Chairman of subcommittee of IRPS in 2022.
研究兴趣
论文共 52 篇作者统计合作学者相似作者
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2022 IEEE International Reliability Physics Symposium (IRPS)pp.1-7, (2022)
T. C. Yu,Ch Wang,L. H. Chang,M. S. Yeh,M. C. Lin,C. H. Lo,M. H. Tsai,F. T. Chung,M. H. Chang, L. J. Chen,Z. K. Liu, C. L. Tsai,
8TH INTERNATIONAL PARTICLE ACCELERATOR CONFERENCE (IPAC 2017) (2017)
Y T Li,P C Huang,Frank S Tsai,K R Li,C H Lin, Z J Lin,Yu Ling Liu,W S Sie, S K Hsu,Y M Lin,W C Lin,C C Liu,
Planarization/CMP Technologypp.186-189, (2014)
Planarization/CMP Technologypp.63-65, (2014)
Planarization/CMP Technologypp.183-185, (2014)
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