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个人简介
Luke Prenger received the B.Sc. degree in chemical engineering from the Missouri University of Science and Technology (Missouri S&T), Rolla, MO, USA, in 2016.
Shortly after graduation, he began his career with Brewer Science, Inc., Rolla, where he currently works in research and development as a Research Associate III, leading a team to develop the next-generation material solutions for wafer-level packaging applications. Over his time at Brewer Science, Inc., he has authored and coauthored six conference papers on materials and technologies in wafer-level packaging.
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Luke Prenger,Xavier Martinez,Andrea Chacko,Vikram Turkani, Lauren Reimnitz,Vahid Akhavan,Kurt Schroder
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1287-1293, (2022)
International Symposium on Microelectronicsno. 1 (2021): 000067-000073
Electronic Components and Technology Conferencepp.1463-1469, (2019)
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)no. DPC (2019): 000908-000931
2019 International Wafer Level Packaging Conference (IWLPC)pp.1-8, (2019)
2018 International Wafer Level Packaging Conference (IWLPC)pp.1-8, (2018)
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