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个人简介
Vincent Leung (Senior Member, IEEE) received the B.Eng. (Hons.) and M.Eng. degrees in electrical and computer engineering from McGill University, Montreal, QC, Canada, and the Ph.D. degree in electrical and computer engineering from the University of California at San Diego, La Jolla, CA, USA, in 1995, 1997, and 2004, respectively. He had nearly two decades of industrial analog/RF IC R&D experience: Analog Devices during 1997–2000, IBM T. J. Watson Research in 2004, Silicon Laboratories during 2005–2008. At Qualcomm San Diego during 2008–2016, he held key design and lead positions for 3G/4G RF chips found in virtually all smartphones at the time. In 2016, he joined UCSD/ Qualcomm Institute as the Technical Director of Circuits Lab, where he researched circuit techniques for biomedical and IoT applications. He had taught graduate courses on Analog VLSI and RFICs with Columbia University, New York City, NY, USA, during 2007–2009, and UCSD during 2017–2019, respectively. He has coauthored more than 40 technical papers in referred journals and conference proceedings and holds 13 U.S. patents. In 2020, he joined Baylor University, Waco, TX, USA, as an Associate Professor with ECE Department. His research interests include neurotechnology, and RF/ mm-Wave ICs for defense and commercial applications.
研究兴趣
论文共 68 篇作者统计合作学者相似作者
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Nature Electronicsno. 4 (2024): 1-12
2024 IEEE TOPICAL CONFERENCE ON RF/MICROWAVE POWER AMPLIFIERS FOR RADIO AND WIRELESS APPLICATIONS, PAWRpp.13-16, (2024)
Advanced science (Weinheim, Baden-Wurttemberg, Germany)no. 36 (2023): n/a-n/a
Vincent W. Leung,Ah-Hyoung Lee,Jihun Lee,Sravya Alluri, Julian Alonzo, Luke Mello, Brett Beyer, David Durfee, Wing-Fat Andy Lau,Peter M. Asbeck,Lawrence E. Larson,Farah Laiwalla,
2023 IEEE Biomedical Circuits and Systems Conference (BioCAS)pp.1-5, (2023)
Handbook of Neuroengineeringpp.419-440, (2023)
2023 11th International IEEE/EMBS Conference on Neural Engineering (NER)pp.1-4, (2023)
2023 IEEE Biomedical Circuits and Systems Conference (BioCAS)pp.1-5, (2023)
NSDIpp.1201-1219, (2023)
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IEEE JOURNAL OF ELECTROMAGNETICS RF AND MICROWAVES IN MEDICINE AND BIOLOGYno. 3 (2023): 258-265
2023 IEEE Biomedical Circuits and Systems Conference (BioCAS)pp.1-5, (2023)
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