基本信息
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Bio
He has approximately 15 years of industy experience at Intel and VLSI Technology Inc. He contributed to a number of miroprocessor and chipset designs and was most recently a principal engineer and circuit design manager for the Xscale microprocessors. He also worked on compact modeling, reliability modeling and CMOS imagers.
His areas of expertise include low power high performance VLSI radiation hardening and harsh environment VLSI CAD and device behavior for VLSI.
His areas of expertise include low power high performance VLSI radiation hardening and harsh environment VLSI CAD and device behavior for VLSI.
Research Interests
Papers共 257 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE Transactions on Device and Materials Reliabilityno. 1 (2023): 162-171
Ryan Melendez, Leonardo Martinez,Lawrence T. Clark,Cliff S. YoungScioritino,Steven M. Guertin,Jean Yang-Scharlotta
2023 IEEE Radiation Effects Data Workshop (REDW) (in conjunction with 2023 NSREC)pp.1-4, (2023)
Lawrence T. Clark,Clifford S. YoungSciortino,Maximilian Siath, Leonardo Martinez,William E. Brown, Shayena Khandker, Azad Derbedrosian, Sungho Kim,Ryan Melendez,Steven M. Guertin,Jean Yang-Scharlotta
2022 IEEE International Integrated Reliability Workshop (IIRW)pp.1-4, (2022)
2022 22nd European Conference on Radiation and Its Effects on Components and Systems (RADECS)pp.1-6, (2022)
2022 IEEE Aerospace Conference (AERO)pp.1-11, (2022)
IEEE Transactions on Nuclear Scienceno. 12 (2022): 2305-2313
2022 IEEE Aerospace Conference (AERO)pp.1-10, (2022)
Jereme Neuendank,Matthew Spear,Trace Wallace,Donald Wilson,Jose Solano, Gedeon Irumva,Ivan Sanchez Esqueda,Hugh J. Barnaby,Lawrence T. Clark,John Brunhaver,Marek Turowski, Esko Mikkola,
2022 IEEE Radiation Effects Data Workshop (REDW) (in conjunction with 2022 NSREC)pp.1-9, (2022)
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Author Statistics
#Papers: 262
#Citation: 5617
H-Index: 34
G-Index: 53
Sociability: 6
Diversity: 1
Activity: 1
Co-Author
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