基本信息
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Career Trajectory
Bio
Lauren Boteler received the Ph.D. degree from the University of Maryland, College Park, MD, USA, in 2011, with a focus on microfabrication and analysis of advanced cooling structures to reduce the thermal stack.
She has been a Packaging and Thermal Management Engineer with the Advanced Power Packaging Team, United States Army Research Laboratory, Adelphi, MD, USA, since 2005. She focuses on advanced power electronics packaging, including research in integrated heat sinks, stacked power devices, transient thermal mitigation, additively manufactured parts, multifunctional components, and high-voltage operation.
Research Interests
Papers共 47 篇Author StatisticsCo-AuthorSimilar Experts
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semanticscholar(2021)
L. M. Boteler, S. M. Miner
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2019 (2020)
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2019 (2020)
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2019 (2020)
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Author Statistics
#Papers: 45
#Citation: 402
H-Index: 11
G-Index: 18
Sociability: 5
Diversity: 0
Activity: 0
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