基本信息
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Bio
His main research contributions are in the theoretical analysis and in the computational investigation of electric circuits and electromagnetic fields. In his research on heat transfer and thermal management of electronic components, he has introduced original industrial-strength approaches to the extraction of compact thermal models, currently available in market leading commercial software. In his research areas, he has authored or coauthored over 200 papers in refereed international journals and conference proceedings. For these activities, he received the Harvey Rosten Award for Excellence, in 2016. He has also been serving as the Chair of the conference THERMal INvestigation of Integrated Circuits (THERMINIC). He has been serving as an Associate Editor for the IEEE Transactions of Components, Packaging and Manufacturing Technology.
Research Interests
Papers共 228 篇Author StatisticsCo-AuthorSimilar Experts
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期刊级别
合作者
合作机构
Journal of Energy Storage (2024): 112087
Energiesno. 10 (2024): 2364
2024 IEEE 28TH WORKSHOP ON SIGNAL AND POWER INTEGRITY, SPI 2024pp.1-3, (2024)
Conference on PhD Research in Microelectronics and Electronicspp.1-4, (2024)
Journal of Computational Physicsno. C (2024): 113196
IEEE Journal of Microwavesno. 3 (2024): 558-567
2023 29TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINICpp.1-7, (2023)
2023 International Conference on Clean Electrical Power (ICCEP)pp.355-361, (2023)
MATHEMATICSno. 6 (2023): 1324-1324
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Author Statistics
#Papers: 230
#Citation: 2532
H-Index: 26
G-Index: 36
Sociability: 5
Diversity: 1
Activity: 3
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