基本信息
浏览量:14
![](https://originalfileserver.aminer.cn/sys/aminer/icon/show-trajectory.png)
个人简介
Kuo-Shu Kao received the M.S. degree in power mechanical engineering from National Tsing Hua University, Hsinchu, Taiwan.
He is currently an Engineer with the Assembly and Reliability Department, Industrial Technology Research Institute, Hsinchu. His current research interests include chip in system packaging, 3-D stacked IC technologies, package structural stress simulation, and microelectronic reliability.
研究兴趣
论文共 47 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
2024 International Conference on Electronics Packaging (ICEP)pp.1-2, (2024)
IEEE Transactions on Power Electronicsno. 99 (2024): 1-12
Po-Kai Chiu,Hsin-Han Lin, Yuan-Cheng Huan,Ji-Yuan Syu,Yan-Cheng Liu, Yan-Bo Fan,Yu-Hua Cheng, Chien-Wei Chang, Yung-Min Hsieh,Kuo-Shu Kao, Chu-Han Tsai
2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)pp.1-4, (2023)
2023 International Conference on Electronics Packaging (ICEP)pp.93-94, (2023)
Jing-Yao Chang,Su-Yu Fun,Sheng-Tsai Wu,Fang-Jun Leu, Yuan-Yin Lo,Po-Kai Chiu,Tai-Jyun Yu, Han-Lin Wu,Wei-Kuo Han,Chih-Ming Tzeng, Shi-Feng Hsu,Kuo-Shu Kao,
PCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Managementpp.1-5, (2020)
引用0浏览0EIWOS引用
0
0
加载更多
作者统计
#Papers: 44
#Citation: 359
H-Index: 11
G-Index: 18
Sociability: 5
Diversity: 1
Activity: 0
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn