基本信息
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Bio
Kuo-Shu Kao received the M.S. degree in power mechanical engineering from National Tsing Hua University, Hsinchu, Taiwan.
He is currently an Engineer with the Assembly and Reliability Department, Industrial Technology Research Institute, Hsinchu. His current research interests include chip in system packaging, 3-D stacked IC technologies, package structural stress simulation, and microelectronic reliability.
Research Interests
Papers共 47 篇Author StatisticsCo-AuthorSimilar Experts
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2024 International Conference on Electronics Packaging (ICEP)pp.1-2, (2024)
IEEE Transactions on Power Electronicsno. 99 (2024): 1-12
Po-Kai Chiu,Hsin-Han Lin, Yuan-Cheng Huan,Ji-Yuan Syu,Yan-Cheng Liu, Yan-Bo Fan,Yu-Hua Cheng, Chien-Wei Chang, Yung-Min Hsieh,Kuo-Shu Kao, Chu-Han Tsai
2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)pp.1-4, (2023)
2023 International Conference on Electronics Packaging (ICEP)pp.93-94, (2023)
semanticscholar(2021)
Jing-Yao Chang,Su-Yu Fun,Sheng-Tsai Wu,Fang-Jun Leu, Yuan-Yin Lo,Po-Kai Chiu,Tai-Jyun Yu, Han-Lin Wu,Wei-Kuo Han,Chih-Ming Tzeng, Shi-Feng Hsu,Kuo-Shu Kao,
PCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Managementpp.1-5, (2020)
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Author Statistics
#Papers: 44
#Citation: 359
H-Index: 11
G-Index: 18
Sociability: 5
Diversity: 1
Activity: 0
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