Kumar A. Singh

Kumar Abhishek Singh (Member, IEEE) received the B.Tech. degree in metallurgical and materials engineering from the Indian Institute of Technology, Kharagpur, Kharagpur, India, in 2005, and the M.S. and Ph.D. degrees in materials science and engineering from Carnegie Mellon University, Pittsburgh, PA, USA, in 2006 and 2010 respectively. Since 2010, he has been a Packaging R&D Engineer with Assembly and Test Technology Division, Intel Corporation, Chandler, AZ, USA. He has authored or coauthored more than 15 peer reviewed articles and has filed for seven inventions. His research interests include development of polymeric semiconductor devices and development of advanced packaging technologies with a recent focus on in-package photonics. He is a Member of various professional societies, including Sigma-Xi, AVS, TMS and was the recipient of the Indian Institute of Metals Students' Award in 2006.