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个人简介
Mr. Dr. Kui Li received his B.S. degree in Mechanism design, manufacturing and automatization, and the M.S. degree in Mechanical engineering from Xidian University, Xi’an, China, in 2010, and 2013, respectively. He is currently studying the Ph.D. degree in Electronic information with the School of Computer Science, Northwestern Polytechnical University, Xi'an, China. He is currently working as a senior engineer with Research and Development Innovation Center at Xi'an Institute of Microelectronics Technology, Xi'an, China. His research interests include Structural Thermodynamic Reliability Simulation and Efficient Thermal Management Technology in Microsystems.
研究兴趣
论文共 8 篇作者统计合作学者相似作者
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JOURNAL OF ELECTRONIC PACKAGINGno. 1 (2024)
CASE STUDIES IN THERMAL ENGINEERING (2024): 103977
Thermal Sciencepp.175-175, (2023)
e-Prime - Advances in Electrical Engineering, Electronics and Energy (2023): 100230-100230
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