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Papers共 74 篇Author StatisticsCo-AuthorSimilar Experts
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2024)
EPILEPSIA OPENno. 2 (2024): 704-716
SPISANIE NA B LGARSKOTO GEOLOGICHESKO DRUZHESTOV-REVIEW OF THE BULGARIAN GEOLOGICAL SOCIETYno. 2 (2023): 25-35
IEEE Transactions on Power Electronicsno. 3 (2023): 3569-3589
2023 29TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINICpp.1-6, (2023)
Qin Wang,Ashutosh Kumar,Martin Berg,Olof Öberg,Mietek Bakowski,Jang‐Kwon Lim, Hithiksha Krishna Murthy,Konstantin Kostov,Saeed Akbari,Michael Salter,Peter Ramvall
ECS transactionsno. 2 (2023): 37-43
2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)pp.1-7, (2022)
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EUREKA: Physics and Engineeringpp.55-66, (2022)
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