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个人简介
Klaus-Jürgen Wolter (SM’08) received the Diploma degree (Dipl.-Ing.) in electrical engineering from the National Technical University of Ukraine “Kyiv Polytechnic Institute,” Kyiv, Ukraine, in 1973, and the Ph.D. degree in electrical engineering from Technische Universität Dresden (TU Dresden), Dresden, Germany, in 1983.
He was the Director of the Electronic Packaging Lab, TU Dresden, from 2003 to 2014. From March 2015 to March 2017, he was a Visiting Professor with the 3D Systems Packaging Research Center, Georgia Tech, Atlanta, GA, USA. He is currently a Senior Professor with TU Dresden. He is well known as coauthor of six textbooks, coeditor of three book series with a total of 39 books, and author or coauthor of more than 200 articles. His research interests have embraced many aspects of microelectronics packaging, including substrate technologies, assembly technologies, photonic packaging, MEMS, joining technologies, reliability of electronic packages, and nondestructive test methods.
Dr. Wolter is a Senior Member of the IEEE Electronics Packaging Society (EPS).
研究兴趣
论文共 324 篇作者统计合作学者相似作者
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 1 (2020): 1-1
Applied Industrial Optics: Spectroscopy, Imaging and Metrology (2019)
2018 7th Electronic System-Integration Technology Conference (ESTC)pp.1-6, (2018)
2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)pp.1-8, (2018)
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作者统计
#Papers: 322
#Citation: 2896
H-Index: 24
G-Index: 37
Sociability: 6
Diversity: 2
Activity: 0
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