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Papers共 63 篇Author StatisticsCo-AuthorSimilar Experts
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2024)
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2023)
2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)pp.1-7, (2022)
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IEEE Transactions on Components, Packaging, and Manufacturing Technology (2022): 1857-1866
Asa Claesson, Ola Lyckfeldt,Jonas Lindqvist,Victor Kardeby,Erik Lejon,Petter Ulfberg, Helen Rendall, Gunnar Hedin, Peter Ottosson, David Ohlsson,Anders Kvarned,Seshendra Karamchedu,
Smart Systems Integration 13th International Conference and Exhibition on Integration Issues of Miniaturized Systemspp.1-8, (2019)
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Author Statistics
#Papers: 63
#Citation: 1766
H-Index: 23
G-Index: 23
Sociability: 6
Diversity: 2
Activity: 23
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