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Research Interests

Papers共 78 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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Improved waveguide surface roughness by foundry-processing techniques for enhanced light delivery to integrated ion trap for quantum computing platforms
Simon Chun Kiat Goh, Adrian Utama, Haitao Yu,Yan Yan Zhou, Mishra Dileep, Clarence Liu, Morteza Ahmadi,Victor Leong,Manas Mukherjee,Chui King-Jien,Hongyu Li
Optical Interconnects XXIV (2024)
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Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink
Huicheng Feng,Gongyue Tang,Xiaowu Zhang,Boon Long Lau,Ming Chinq Jong,Keng Yuen Jason Au, Jun Wei Javier Ong,King Jien Chui, Jun Li,Hongying Li,Duc Vinh Le,Jing Lou
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 3 (2024): 397-405
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Demonstration of a CMOS-Compatible Superconducting Cryogenic Interposer for Advanced Quantum Processors
King-Jien Chui,Hongyu Li, Yong Chyn Ng,Chit Siong Lau, K. E. J. Goh,D. Huang, Ya-Ching Tseng, J. K. Chen,H. Yu, B. N. Jaafar, H. Lin, B. Varghese
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.617-622, (2023)
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Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing
Simon Chun Kiat Goh, Cheemalamarri Hemanth Kumar,Liangxing Hu, Woon Shervonne,Norhanani Jaafar, Yap Lee Khoon Sherry,Ding Huang,Chit Siong Lau, Senthil Kumar Karuppannan,Hongyu Li,Chuan Seng Tan,King-Jien Chui
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.404-408, (2023)
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CMOS-Compatible Fine Pitch Al-Al Bonding
Hemanth Kumar Cheemalamarri, Binni Varghese,Sharma Jaibir,Li Hongyu,Chandra S. S. Rao,Navab Singh,Vempati Srinivasa Rao,King-Jien Chui
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1725-1729, (2023)
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A Precise Wafer Thinning Integration Process for nano-TSV Formation
Ya-Ching Tseng, Simon Chun Kiat Goh,Senthilkumar Darshini,Nandini Venkataraman,Arvind Sundaram, Tew Chin Khang,Yoo Jae Ok,King-Jien Chui
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1170-1174, (2023)
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Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs
Huicheng Feng,Gongyue Tang,Xiaowu Zhang,Boon Long Lau,Ming Chinq Jong, Keng Yuen Jason Au,King Jien Chui,Jing Lou,Hongying Li,Duc Vinh Le
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1964-1968, (2023)
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Process Development and Integration for Wafer-to-Wafer Hybrid Bonding
Hongyu Li,Hong Miao Ji, Gim Guan Chen,Alfred Neo Siang Kiat, Teo Wei Jie Dickson,K.–J. Chui
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.01-04, (2022)
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Wafer Stacked Wide I/O DRAM with One-step TSV Technology
Masaya Kawano,Xiang-Yu Wang,Qin Ren,Woon-Leng Loh,B. S. S. Chandra Rao,King-Jien Chui,Tsuyoshi Kawagoe, Ichiro Homma
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.143-148, (2022)
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