基本信息
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Bio
Kevin Kröhnert received the M.Sc. degree in electrical engineering from the Technical University of Berlin, Berlin, Germany, in 2014.
In 2008, he started to work as a Student Assistant with Fraunhofer IZM, Berlin. After his graduation in 2014, he continued to work with Fraunhofer IZM. He is responsible for physical vapor deposition (PVD), dicing and grinding processes, and acquisition and realization of various projects regarding microtechnology with a focus on glass interposer and wafer-level packaging.
Research Interests
Papers共 15 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE Journal of Microwavesno. 2 (2023): 783-799
IEEE Transactions on Microwave Theory and Techniquesno. 7 (2023): 2807-2817
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)pp.391-397, (2022)
2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)pp.1-6, (2022)
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IEEE Journal of Microwavesno. 1 (2022): 97-107
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1010-1018, (2022)
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)pp.1-8, (2021)
Kevin Krohnert,Georg Friedrich, Dzmitry Starukhin,Markus Wohrmann,Michael Schiffer,Martin Schneider-Ramelow
2019 International Wafer Level Packaging Conference (IWLPC)pp.1-9, (2019)
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