基本信息
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Career Trajectory
Bio
Kevin R. Bagnall received the B.S. degree in mechanical engineering from the University of Oklahoma, Norman, OK, USA, in 2009, and the M.S. and Ph.D. degrees in mechanical engineering from the Massachusetts Institute of Technology (MIT), Cambridge, MA, USA, in 2013 and 2017, respectively.
From 2011 to 2017, he was a Research Assistant with the Department of Mechanical Engineering, Device Research Laboratory, MIT. In 2014, he joined Analog Devices, Inc., Wilmington, MA, USA, as an Intern. His current research interests include microscale/nanoscale thermal transport, thermal issues in electronics, solid-state device physics, and thermal metrology techniques.
Dr. Bagnall was a recipient of the National Defense Science and Engineering Graduate Fellowship and the MIT Rohsenow Mechanical Engineering Graduate Fellowship.
Research Interests
Papers共 31 篇Author StatisticsCo-AuthorSimilar Experts
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Thomas Feigenson, Kelsey Johnsen,Dave Kharas,Wonseok Shin,Ryan Maxson,Kevin Bagnall,Adam Libson,Andrew Benedick,William Loh,Cheryl Sorace-Agaskar,Danielle Braje,Robert McConnell,
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 8 (2019): 1663-1663
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 8 (2019): 1663-1663
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 2 (2019): 269-278
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Author Statistics
#Papers: 31
#Citation: 1049
H-Index: 20
G-Index: 31
Sociability: 5
Diversity: 1
Activity: 0
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