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个人简介
Teo Keng Hwa is the Senior Manager of Joint Lab Program at Institute of Microelectronics (IME). He is responsible for the Applied Materials-IME Advanced Packaging Center. In the past, he has also spearheaded IME's 3D TSV Consortium and various technology licensing and collaborations with industry. He was also a senior research engineer at the same Institute. Mr Teo has more than 20 publications. He received his Master degree in Electrical Engineering (Microelectronics) from the National University of Singapore, and Bachelor degree with 2nd Class Honors (Upper Division) in Materials Engineering from the Nanyang Technological University.
研究兴趣
论文共 16 篇作者统计合作学者相似作者
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Sanming Hu,Cheng Jin,Hongyu Li,Rui Li,Ser Choong Chong,Ming Chinq Jong,Eva Leong Ching Wai,Keng Hwa Teo,Minkyu Je, Patrick Guo Qiang Lo
Electronics Packaging Technology Conferencepp.250.0-254, (2013)
electronics packaging technology conferencepp.341-344, (2011)
Components, Packaging and Manufacturing Technology, IEEE Transactionsno. 12 (2011): 1988-1995
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作者统计
#Papers: 16
#Citation: 143
H-Index: 7
G-Index: 7
Sociability: 4
Diversity: 2
Activity: 0
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