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个人简介
He has worked on lead-free soldering, conductive adhesive, power electronics packaging and printed electronics and published several books both on lead-free soldering and on printed electronics. He is currently in charge of the several projects such as Conductive adhesive testing methods standardization (JEITA), Printed electronics standardization IEC TC119 Japan committee (JEITA), Chairman of Printed Electronics on Circuits (JPCA) and WGB system integration consortium.
研究兴趣
论文共 740 篇作者统计合作学者相似作者
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CORROSION SCIENCE (2024): 111614-111614
Materials Science and Engineering: App.146089, (2024)
Ming-Chun Hsieh,Zheng Zhang,Masahiko Nishijima,Aiji Suetake,Chuantong Chen, Hiroyoshi Yoshida,Wangyun Li, Rieko Okumura,Hidekazu Homma,Koji Kita,George Okada,Katsuaki Suganuma
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1381-1384, (2023)
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2023 International Conference on Electronics Packaging (ICEP)pp.189-190, (2023)
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Microelectronics Reliability (2023): 115211-115211
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2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-4, (2023)
Zheng Zhang,Ming-Chun Hsieh,Aiji Suetake,Hiroshi Yoshida, Rieko Okumuara,Noriko Kagami, Kazamasa Okamoto,Chuantong Chen, Kei Hashizume,Norihiko Hasegawa, Ryuji Yoshida,Hidekazu Homma,
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)no. EMPC (2023): 1-3
2023 International Conference on Electronics Packaging (ICEP)pp.249-250, (2023)
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2023 International Conference on Electronics Packaging (ICEP)pp.91-92, (2023)
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Journal of Science: Advanced Materials and Devicesno. 3 (2023): 100606
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