基本信息
浏览量:0
职业迁徙
个人简介
暂无内容
研究兴趣
论文共 19 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2024)
Prashant Kumar Singh,Patrick Rohlfs, Gunther Sandmann,Kashi Vishwanath Machani, Dirk Breuer,Karsten Meier,Frank Kuechenmeister,Marcel Wieland,Karlheinz Bock
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)no. EMPC (2023): 1-6
2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAMpp.1-3, (2023)
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-10, (2023)
Viktor Dudash,Kashi Vishwanath Machani,Karsten Meier, Holm Geisler, Maik Mueller,Frank Kuechenmeister, Marcel Wieland,Karlheinz Bock
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.757-763, (2023)
2023 IEEE International Reliability Physics Symposium (IRPS)pp.1-6, (2023)
2022 45th International Spring Seminar on Electronics Technology (ISSE)pp.1-6, (2022)
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)pp.1100-1105, (2020)
Frank Kuechenmeister,Dirk Breuer,Holm Geisler,Bjoern Boehme,Kashi Vishwanath Machani,Michael Hecker, Sven Kosgalwies,Jae Kyu Cho, Dongming He, Xuefeng Zhang,Lily Zhao
International Symposium on Microelectronicsno. 1 (2018): 000173-000179
加载更多
作者统计
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn