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Bio
Karthik Arun Deo received the B.S. degree in mechanical engineering from the Amrita School of Engineering, Vallikavu, India, in 2015, and the M.S. degree in thermal engineering from IIT Madras, Chennai, India, in 2019. He is currently pursuing the Ph.D. degree in mechanical engineering with the Opto-Mechanics and Physical Reliability Laboratory, State University of New York at Binghamton, Binghamton, NY, USA.
His current research interests include package and board-level reliability and failure analysis.
Research Interests
Papers共 12 篇Author StatisticsCo-AuthorSimilar Experts
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1639-1643, (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1814-1819, (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1538-1542, (2024)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.907-913, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1773-1778, (2023)
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 9 (2023): 1388-1398
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-6, (2022)
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.2269-2274, (2022)
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