基本信息
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Bio
Klaus Pressel received the Ph.D. degree from the University of Stuttgart, Stuttgart, Germany, with a focus on optical spectroscopy of 3d and 4f transition metal elements in III/V semiconductors. He studied physics at the University of Würzburg, Würzburg, Germany, and at the State University of New York at Albany, Albany, NY, USA.
He then joined IHP, Frankfurt (Oder), Germany, where he worked for eight years and focused on both Si CMOS and SiGeC R&D. He was the Department Head for Material, Diagnostics, and Foundry. In 2001, he joined Infineon Technologies AG, Regensburg, Germany, where he now focuses on innovations in assembly and packaging technology. He has authored or coauthored more than 150 articles in semiconductor physics and technology, circuit design, assembly, and interconnect technology, and owns/coowns 15 patents. His special interests are SiP, HF applications, and chip-package-board/system codesign. He was/is a project leader of several EU-funded projects.
Dr. Pressel is representing Infineon in various international technical committees, e.g., the SEMI Advanced Packaging Conference, the ESTC, the Eureka CATRENE and EURIPIDES Programs, and the Heterogeneous Integration Roadmap Initiative.
Research Interests
Papers共 65 篇Author StatisticsCo-AuthorSimilar Experts
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MICROELECTRONICS RELIABILITY (2023): 114973-114973
Klaus Pressel, Josef Moser
2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)pp.1-5, (2022)
Handbook of Silicon Based MEMS Materials and Technologiespp.691-706, (2020)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 1 (2020): 44-56
2020 IEEE MTT-S International Wireless Symposium (IWS)pp.1-3, (2020)
Antenna‐in‐Package Technology and Applicationspp.219-265, (2020)
International Symposium on Microelectronicsno. S2 (2019)
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Author Statistics
#Papers: 64
#Citation: 1136
H-Index: 23
G-Index: 32
Sociability: 5
Diversity: 2
Activity: 1
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