基本信息
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Bio
Kuo-Ning Chiang (F'13) is currently a Chaired Professor with National Tsing Hua University. He is the author of more than 300 technical papers in international journals and conference proceedings and he own more than 40 patents. His vision and research performance drives to establish a “Design on Simulation (DOS)”-based development procedure for advanced packaging products such as WLCSP and 3D packages. He has collaborated with many electronic packaging houses, and semiconductor and LED companies such as ACET, TSMC, UMC, EPISTAR (LED), VIA, etc.
Prof. Chiang is the Co-Editor-in-Chief of
IEEE Transactions on Components, Packaging and Manufacturing Technology and the Editor-in-Chief of
Journal of Mechanics.
Research Interests
Papers共 276 篇Author StatisticsCo-AuthorSimilar Experts
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JOURNAL OF MECHANICS (2023): 183-190
Z. Shu,K. N. Chiang
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2023)
Materials (Basel, Switzerland)no. 14 (2023): 4922-4922
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
H. L. Chen,K. N. Chiang
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2023)
MATERIALSno. 11 (2022): 3897
Y. W. Huang,K. N. Chiang
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.1-4, (2022)
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.1-4, (2022)
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