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个人简介
Katia Devriendt received her Ph.D. degree in Chemistry at the University of Leuven, Belgium in June 1997 and worked since than in the Electrodepositing, CMP and Thinning group at imec, Belgium. She was involved in the process development of STI, ILD, W and Al CMP and post-CMP cleaning processes.
She is currently involved in the FEOL CMP process steps and modules development of the 14 nm FinFET technology as a senior R&D engineer.
研究兴趣
论文共 95 篇作者统计合作学者相似作者
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A. Vandooren, K. Stiers, C. Sheng,C. Toledo de Carvalho Cavalcante,M. Hosseini,D. Batuk, A. Peng, X. Zhou,H. Mertens,A. Veloso, A. Mingardi, S. Sarkar Kumar, R. Kumar Saroj,K. D'havé,T. Chiarella,J. Bömmels,R. Loo,E. Rosseel,C. Porret,Y. Shimura, A. Akula,S. Choudhury,V. Brissonneau,E. Dupuy, T. Sarkar,A. Peter,N. Jourdan,J.P. Soulie,K. Vandersmissen,S. Iacovo,D. Montero,E. Vrancken,F. Sebaai,P. Puttarame Gowda, K. Lai,N. Buccheri,P. Matagne,B. T. Chan, A. Sepulveda Marquez,R. Langer, I. Gyo Koo,E. Altamirano Sanchez,K. Devriendt,F. Lazzarino,J. Mitard,J. Geypen,E. Grieten, Y-F. Chen, F. Verbeek, H. Pollenus,J. Heijlen,L.P.B. Lima,F. Holsteyns,S. Subramanian,N. Horiguchi,S. Demuynck,S. Biesemans
2024 IEEE International Electron Devices Meeting (IEDM)pp.1-4, (2024)
Steven Demuynck,Victor Vega-Gonzalez,C. Toledo de Carvalho Cavalcante,L. Petersen Barbosa Lima, K. Stiers, C. Sheng,A. Vandooren,M. Hosseini, X. Zhou,Hans Mertens,Thomas Chiarella,Jürgen Bömmels,Roger Loo,E. Rosseel,Clement Porret,Y. Shimura, A. Akula,G. Mannaert,S. Choudhury,V. Brissonneau,E. Dupuy, T. Sarkar,Nathali Franchina-Vergel,A. Peter,Nicolas Jourdan,J. P. Soulie,Kevin Vandersmissen,F. Sebaai,P. Puttarame Gowda, K. Lai, A. Mingardi, S. Sumar Sarkar,K. D'Have,B. T. Chan, A. Sepulveda Marquez,R. Langer, I. Gyo Koo,E. Altamirano Sanchez,Katia Devriendt, P. Rincon Delgadillo,F. Lazzarino,Jérôme Mitard,J. Geypen,E. Grieten,D. Batuk, Y.-F. Chen, F. Verbeek,F. Holsteyns,S. Subramanian,N. Horiguchi,S. Biesemans
Symposium on VLSI Technologypp.1-2, (2024)
Karl Ceulemans,Ehsan Shafahian,Herbert Struyf,Katia Devriendt, Steven Deckers,Nancy Heylen,Jaber Derakhshandeh
Japanese Journal of Applied Physicsno. 3 (2024): 03SP39-03SP39
V. Vega-Gonzalez, K. Stiers, C. Sheng,S. Demuynck,C Toledo de Carvalho Cavalcante, L. Petersen,T. Chiarella,J. Boemmels, T. Sarkar, N. Franchina Vergel,D. Radisic,R. Loo,E. Rosseel,C. Porret,G. Mannaert,S. Choudhury,V. Brissonneau,E. Dupuy,A. Peter,N. Jourdan,J-P. Soulié,T. Hakamata, A. Romo-Negreira,R. Clark,K. Vandersmissen,F. Sebaai,P. Puttarame Gowda, J.G. Lai, A. Mingardi, S. Kumar Sarkar,B. T. Chan, A. Sepulveda Marquez,R. Langer, I. Gyo Koo,E. Altamirano Sanchez,K. Devriendt, P. Rincon Delgadillo,F. Lazzarino,J. Mitard,J. Geypen,D. Batuk, Y-F. Chen, F. Verbeeck,F. Holsteyns,S. Subramanian,Zs. Tőkei,N. Horiguchi,S. Biesemans
2024 IEEE International Interconnect Technology Conference (IITC)pp.1-3, (2024)
Zheng Tao,Yisuo Li,Waikin Li,Minsoo Kim,Basoene Briggs,Katia Devriendt,Lieve Teugels,Farid Sebaai,Christophe Lorant,Clement Porret,Erik Rosseel,Alfonso Sepúlveda Márquez,Nicolas Jourdan,Juergen Boemmels,Jerome Mitard,Philippe Matagne,Efrain Altamirano-Sánchez,Lars-Ake Ragnarsson,Anish Dangol,Dmitry Batuk,Gerardo Tadeo Martinez Alanis,Jef Geypen, Kenichi Kanazawa, Testuo Izawa,Masakazu Kakumu,Koji Sakui,Nozomu Harada
Advanced Etch Technology and Process Integration for Nanopatterning XI (2022)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (2022)
A. Gupta,Z. Tao,D. Radisic,H. Mertens,O. Varela Pedreira,S. Demuynck,J. Boemmels,K. Devriendt,N. Heylen,S. Wang,K. Kenis,L. Teugels,F. Sebaai,C. Lorant,N. Jourdan,B. T. Chan,S. Subramanian,F. Schleicher,A. Peter,N. Rassoul, Y. Siew,B. Briggs,D. Zhou,E. Rosseel,E. Capogreco,G. Mannaert,A. Sepulveda,E. Dupuy,K. Vandersmissen,B. Chehab,G. Murdoch,E. Altamirano Sanchez,S. Biesemans,Zs Tokei,E. Dentoni Litta,N. Horiguchi
A. Veloso,A. Jourdain,D. Radisic,R. Chen,G. Arutchelvan,B. O'Sullivan,H. Arimura,M. Stucchi,A. De Keersgieter,M. Hosseini,T. Hopf,K. D'have,S. Wang,E. Dupuy,G. Mannaert,K. Vandersmissen,S. Iacovo,P. Marien,S. Choudhury,F. Schleicher,F. Sebaai,Y. Oniki, X. Zhou,A. Gupta,T. Schram,B. Briggs,C. Lorant,E. Rosseel,A. Hikavyy,R. Loo,J. Geypen,D. Batuk,G. T. Martinez,J. P. Soulie,K. Devriendt,B. T. Chan,S. Demuynck,G. Hiblot,G. Van der Plas,J. Ryckaert,G. Beyer,E. Dentoni Litta,E. Beyne,N. Horiguchi
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (2022)
A. Gupta,D. Radisic,J. W. Maes,O. Varela Pedreira,J-P Soulie,N. Jourdan,H. Mertens, S. Bandyopadhyay,Q. T. Le,A. Pacco,N. Heylen,K. Vandersmissen,K. Devriendt,C. Zhu,S. Datta,F. Sebaai,S. Wang,M. Mousa, J. Lee,J. Geypen,B. De Wachter,B. Chehab,S. M. Salahuddin,G. Murdoch,S. Biesemans,Zs Tokei,E. Dentoni Litta,N. Horiguchi
2021 IEEE International Electron Devices Meeting (IEDM) (2021)
A. Veloso,A. Jourdain,G. Hiblot,F. Schleicher,K. D’have,F. Sebaai,D. Radisic,R. Loo,T. Hopf,A. De Keersgieter,H. Arimura,G. Eneman,P. Favia,J. Geypen,G. Arutchelvan,A. Chasin,D. Jang,L. Nyns,E. Rosseel,A. Hikavyy,G. Mannaert,B. T. Chan,K. Devriendt,S. Demuynck,G. Van der Plas,J. Ryckaert,G. Beyer,E. Dentoni Litta,E. Beyne,N. Horiguchi
Symposium on VLSI Technologypp.1-2, (2021)
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#Papers: 95
#Citation: 2080
H-Index: 25
G-Index: 43
Sociability: 7
Diversity: 2
Activity: 1
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