基本信息
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Bio
Prolific inventor with 1700+ issued US patents, and 2400+ worldwide issued patents
100+ peer-referred journal articles and conference presentations, including invited/highlighted presentations at VLSI Symposia and IEDM
Deep knowledge in semiconductor process integration, device physics, and materials science
Inspiring and mentoring young engineers/scientist on invention
A team leader with excellent communication and mentoring skills in highly diverse organizations
A fast learner on emerging technologies
IEEE Fellow
Research Interests
Papers共 446 篇Author StatisticsCo-AuthorSimilar Experts
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ADVANCED INTELLIGENT SYSTEMSno. 5 (2022): n/a-n/a
K. Motoyama,O. van der Straten,J. Maniscalco,K. Cheng, S. DeVries,H. Huang, T. Shen,N. Lanzillo, S. Hosadurga, K. Park, T. Bae, H. Seo,
2020 IEEE International Interconnect Technology Conference (IITC)pp.13-15, (2020)
J. Li,Y. Kim,D. Kong,K. Cheng,S. -C. Seo, C. Robinson, N. Saulnier,R. R. Robison, A. J. Varghese,I. Ahsan,R. Muralidhar,T. Ando,
International Symposium for Testing and Failure AnalysisISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis (2020)
Kangguo Cheng, Chanro Park, Heng Wu,Juntao Li,Son Nguyen,Jingyun Zhang, Miaomiao Wang, Sanjay Mehta,Zuoguang Liu, Richard Conti,Nicolas J. Loubet,Julien Frougier,
2018 IEEE International Reliability Physics Symposium (IRPS)pp.6E.1-1-6E.1-6, (2018)
ECS Meeting Abstractsno. 22 (2018): 1371-1371
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