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Bio
Karlheinz Bock (Senior Member, IEEE) received the Engineering Diploma degree in electronics and communication engineering from the University of Saarbrücken, Saarbrücken, Germany, in June 1986, the Dr.Ing. degree in RF microelectronics from the University of Darmstadt, Darmstadt, Germany, in February 1994, the Dr. Honoris Causa degree from the Politehnica University of Bucharest, Bucharest, Romania, in 2012, and the Dr. Honoris Causa degree from the Polytechnical-Viktor Sikorsky-University of Kiev, Kiev, Ukraine, in 2019.
He was a Systems Analyst with Information and Communication Technology (ICT) from 1986 to 1989. Since March 1989, he has been a Research Associate with the University of Darmstadt. He spent a post-doctoral year (on leave) with the invitation of the Japan Society for the Promotion of Science, Tokyo, Japan, in August 1994, at Tohoku University, Sendai, Japan, working on Si/SiGe resonant tunneling diodes, chemical vapor deposition (CVD) layer growth, and manufacturing technology. He was a Senior Researcher on ESD reliability of submicrometer CMOS with imec vzw, Leuven, Belgium, from March 1996 to July 1999. From August 1999 to December 2000, he was the Business Director for ICT consulting with Fraunhofer Management GmbH, Munich, Germany. From January 2001 to September 2014, he was the Head of the Polytronic and Multi-Functional Systems Department, Fraunhofer Institute for Reliability and Microintegration IZM (from 2010, EMFT), Munich. From 2010 to 2012, he was the Acting Director of the Fraunhofer EMFT. From March 2008 to September 2014, he was a Professor of polytronic microsystems with the University of Berlin (TU Berlin), Berlin, Germany. Since October 2014, he has been a Professor of electronics packaging and the Director of the Institute for Electronics Packaging (IAVT), University of Dresden (TU Dresden), Dresden, Germany.
Dr. Bock currently serves as the Vice-Dean of the Faculty and the Technical Committee Chair for emerging technologies of the IEEE Electronics Packaging Society (EPS) and a member of the Board of Governors of the IEEE EPS for Region 8.
Research Interests
Papers共 237 篇Author StatisticsCo-AuthorSimilar Experts
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Journal of Microelectronics and Electronic Packagingno. 1 (2024)
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1790-1796, (2024)
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2024)
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.751-756, (2023)
Victoria Constance Köst,Zahra Fekri, Jens Zscharchuch,Krzysztof Nieweglowski, Athur Erbe,Karlheinz Bock
2023 46th International Spring Seminar on Electronics Technology (ISSE)pp.1-4, (2023)
2023 46th International Spring Seminar on Electronics Technology (ISSE)pp.1-4, (2023)
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)no. EMPC (2023): 1-6
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-4, (2023)
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)no. EMPC (2023): 1-8
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