基本信息
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Career Trajectory
Bio
Achievement
Best Award Winner, DesignCon 2011 – “Passive Equalizer Design Using Defected Ground Structures on PCBs, Y. Shim”
Best Student Paper Award, EMC Compo 2011 – “Vertical Noise Coupling on Wideband Low Noise Amplifier from On-chip Switching Mode DC-DC Converter in 3D-IC, K. Koo”
Best Paper Award, IMWS-IWPT 2012 – “Multi-Helix Inductor of WPT System for 3-D Stacked Package, E. Song“
C. Hwang, “A Novel Active EBG Structure using CMOS Process for Simultaneous Switching Noise Suppression in an On-chip Power Distribution Network”, IEEE MWCL 2011.
M. Kim, “A Compact and Wideband Electromagnetic Bandgap Structure using a Defected Ground Structure for Power/Ground Noise Suppression in Multi-layer Packages and PCBs”, IEEE TEMC 2012.
Best Award Winner, DesignCon 2011 – “Passive Equalizer Design Using Defected Ground Structures on PCBs, Y. Shim”
Best Student Paper Award, EMC Compo 2011 – “Vertical Noise Coupling on Wideband Low Noise Amplifier from On-chip Switching Mode DC-DC Converter in 3D-IC, K. Koo”
Best Paper Award, IMWS-IWPT 2012 – “Multi-Helix Inductor of WPT System for 3-D Stacked Package, E. Song“
C. Hwang, “A Novel Active EBG Structure using CMOS Process for Simultaneous Switching Noise Suppression in an On-chip Power Distribution Network”, IEEE MWCL 2011.
M. Kim, “A Compact and Wideband Electromagnetic Bandgap Structure using a Defected Ground Structure for Power/Ground Noise Suppression in Multi-layer Packages and PCBs”, IEEE TEMC 2012.
Research Interests
Papers共 657 篇Author StatisticsCo-AuthorSimilar Experts
By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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期刊级别
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合作机构
Jiwon Yoon,Youngsu Kwon, Hyunwoo Kim, Juhyeon Lee,Joungho Kim, Sungjin Kim, Heejun Jang, Kyun Ahn, Jinhan Kim,Taekyeong Hwang,Yi-Gyeong Kim, Minseok Choi
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1687-1693, (2024)
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYno. 1 (2024): 256-269
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYno. 3 (2024): 949-959
2023 20TH INTERNATIONAL SOC DESIGN CONFERENCE, ISOCCpp.213-214, (2023)
2023 IEEE WIRELESS POWER TECHNOLOGY CONFERENCE AND EXPO, WPTCE (2023)
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2023)
2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPSpp.1-3, (2023)
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYno. 6 (2023): 1674-1683
2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPSpp.1-3, (2023)
2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPSpp.1-3, (2023)
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Author Statistics
#Papers: 690
#Citation: 12196
H-Index: 44
G-Index: 87
Sociability: 7
Diversity: 3
Activity: 17
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