基本信息
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Career Trajectory
Bio
Jonggyu Park received the B.S. degree in electronic engineering from Kyungpook National University, Daegu, South Korea, in 1993.
He was with the Samsung Electronics in 1994, where he was involved in SOC PE and Test team. Starting with Fiber Channel SerDes IP in 1998, he has mainly contributed to improving and standardizing the consistency of PHY SI/PI verification for SATA/SAS/PCIe interfaces of storage devices for nearly 25 years. He is currently in charge of solid-state drive (SSD) system H/W design as a team header, Vice President. His current industrial interests include high-capacity, high-efficiency, and low-power SSD product development with comprehensive competitiveness optimization technology researches.
Research Interests
Papers共 7 篇Author StatisticsCo-AuthorSimilar Experts
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Youngjun Ko,Jinwook Song,Seokwoo Hong,Hyunwoo Kim, Chorom Jang,Sungwoo Jin, Sungwon Roh, Jinan Lee, Jonghee Jeong,Kyungsuk Kim,Jonggyu Park
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2023)
IRPSpp.1-4, (2023)
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)pp.1-3, (2023)
Jinwook Song,Daniel Hyunsuk Jung,Jaeyoung Shin,Chunghyun Ryu,Youngjun Ko,Sungwoo Jin, Soyoung Jung,Kyungsuk Kim,Youngmin Ku,Jung-Hwan Choi, Sunghoon Chun,Jonggyu Park
IEEE Transactions on Signal and Power Integrity (2023): 1-12
Eunho Oh,Junghoon Kim,Yusuf Cinar, Woosung Kim, Byungil Lee, Myungryul Jang, Namho Song,Sungki Lee,Jonggyu Park
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-7, (2023)
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2021)
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2021)
Author Statistics
#Papers: 3
#Citation: 3
H-Index: 1
G-Index: 1
Sociability: 3
Diversity: 0
Activity: 0
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