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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 9 篇作者统计合作学者相似作者

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Key Enabling Materials for 3DIC Fabrication and Device Performance
Michael Gallagher,Ed Anzures, Robert Auger,Rosemary Bell, Berry Paul,Hua Dong, Michelle Ho, Joe Lachowski,Yil-Hak Lee,Masaki Kondo,Julia Kozhukh, Paul Morganelli,
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)no. DPC (2019): 001145-001164
引用2浏览0引用
2
0
(Invited) Additive Impact on Cu Pillar Electrodeposition Process for Packaging Applications
Ravi Pokhrel,Yil-Hak Lee, Won-Hyun Lee, Su-Han Woo,Mark Scalisi, Yu Hua Kao, Luis Gomez,Mark Lefebvre,Jonathan D Prange, Kirk Thompson
ECS Meeting Abstractsno. 33 (2018): 1137-1137
引用0浏览0引用
0
0
Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Applications
Rosemary Bell,Joseph Lachowski, Mitsuru Haga,Inho Lee,Regina Cho,Matthew Thorseth,Jonathan Prange,Mark Scalisi,Yi Qin, Yun-Hyeon Kim,Wataru Tachikawa, Yoon Joo Kim,
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)no. DPC (2017): 1-22
引用0浏览0引用
0
0
Evaluation of High-Speed Copper Plating Products for RDL, Micropillar, and Fan-Out Applications
Matthew A Thorseth,Mark Scalisi,Inho Lee, Sang-Min Park,Yil-Hak Lee,Jonathan Prange,Masaaki Imanari,Mark Lefebvre, Jeff Calvert
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)no. DPC (2016): 000631-000649
引用1浏览0引用
1
0
Versatile Lead-Free Solder Electroplating Products for Advanced Bumping Technologies
Inho Lee,Regina Cho, Lou Grippo, Yen-Lin Taylor, Wayne Baldelli, Ryan Farrell, Julia Woertink,Yi Qin,Jonathan Prange,Yil-Hak Lee,Masaaki Imanari,Jianwei Dong,
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)no. DPC (2014): 001603-001621
引用0浏览0引用
0
0
Copper, Nickel, and Lead-Free Solder Electroplating Solutions for Pillar and Micro-Pillar Capping Applications
Julia Woertink, Erik Reddington,Inho Lee,Yi Qin,Jonathan Prange,Pedro Lopez Montesinos,Jui-Ching Lin,Masaaki Imanari,Jianwei Dong,Wataru Tachikawa, Jeff Calvert
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)no. DPC (2013): 001417-001437
引用0浏览0引用
0
0
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