基本信息
views: 0
![](https://originalfileserver.aminer.cn/sys/aminer/icon/show-trajectory.png)
Bio
John Slabbekoorn received the B.Sc. degree in applied physics from the Fontys University of Applied Sciences, Eindhoven, The Netherlands, in 1991.
From 1992 to 2008, he worked with the Delft University of Technology, Delft, The Netherlands, as a Process Engineer, working in the fields of lithography and laser annealing. He joined imec, Leuven, Belgium, in 2008, working as a Lithography Engineer with the Advanced Packaging Program. From 2013 to 2020, he worked as an Integration Engineer with the Advanced Packaging Program. He is also a Process Engineer, focusing on collective die to wafer bonding.
Research Interests
Papers共 46 篇Author StatisticsCo-AuthorSimilar Experts
By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
François Chancerel, Peter Urban,John Slabbekoorn, Simon Halas,Julian Bravin,Steven Brems,Thomas Uhrmann,Markus Wimplinger,Alain Phommahaxay,Eric Beyne
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.343-347, (2024)
Cong Chen,John Slabbekoorn,Janusz Bogdanowicz,Alain Moussa,Boyao Zhang,Filip Schleicher,Peter Hoffrogge, Ingo Wiesler, Wassim Khaldi,Alain Phommahaxay,Christophe Beral,Gerald Beyer,
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.320-325, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1677-1681, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1080-1084, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.2040-2045, (2023)
JOMno. 12 (2023): 5096-5102
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1364-1368, (2023)
Emmanuel Chery,Anita Brady-Boyd, Yuyuan Lin, Michael Grimes, David Springer,John Slabbekoorn,Edward Walsby,Kristof Croes,Eric Beyne
M. Peeters, S. Sinha, Xiao Sun,Claude Desset,Giuseppe Gramegna,John Slabbekoorn,Pieter Bex, N. Pinho,Tomas Webers,Dimitrios Velenis, A. Miller,Nadine Collaert,
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 7 (2021): 1073-1080
Load More
Author Statistics
Co-Author
Co-Institution
D-Core
- 合作者
- 学生
- 导师
Data Disclaimer
The page data are from open Internet sources, cooperative publishers and automatic analysis results through AI technology. We do not make any commitments and guarantees for the validity, accuracy, correctness, reliability, completeness and timeliness of the page data. If you have any questions, please contact us by email: report@aminer.cn