基本信息
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Bio
John D. Williams is currently the Lead Engineer for additive electronics manufacturing at Boeing Research and Technology (BR&T), Huntsville. After completing his Ph.D. degree, he has served as the Science and Technology Lead for the Metal Micromachining effort at Sandia National Laboratories, Albuquerque, NM. He later joined The University of Alabama, Huntsville, as an Assistant Professor of electrical, materials, and optical engineering, and the Associate Director of the Nano and Micro Devices Center. He has more than 15 years of experience as the PI Lead for prototype development of microelectromechanical systems (MEMS) with over 13 patents and 40 peer reviewed publications in the areas of materials processing, metals, microfabrication, photonics, and RF electronics and bioMEMS. His research has been funded by NSF, DARPA, NASA, NIH, and U.S. ARMY-SMDC. He is currently the Principal Investigator on three NextFlex projects. One to develop flexible antenna arrays, a second to improve off axis printing using an nScrypt printer, and a third to develop the MRL for passive electronic devices. He joined Boeing’ Research and Technology Division, in June 2014, to support new research efforts for RF design and fabrication.
Research Interests
Papers共 62 篇Author StatisticsCo-AuthorSimilar Experts
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Magnetismno. 4 (2023): 267-279
OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) (2020)
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Fred Wang,Ruirui Chen,Handong Gui,Jiahao Niu,Leon Tolbert,Daniel Costinett,Benjamin Blalock,Shengyi Liu, John Hull,John Williams, Timothy Messer, Eugene Solodovnik,
2019 AIAA/IEEE Electric Aircraft Technologies Symposium (EATS)pp.1-9, (2019)
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#Papers: 62
#Citation: 905
H-Index: 20
G-Index: 28
Sociability: 5
Diversity: 1
Activity: 0
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