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Research Interests

Papers共 73 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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Wafer-to-wafer hybrid bonding at 400-nm interconnect pitch
Soon Aik Chew,Joeri De Vos,Eric Beyne
Nature Reviews Electrical Engineeringno. 2 (2024): 71-72
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Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 nm interconnect pitch
Boyao Zhang,Soon-Aik Chew,Michele Stucchi,Sven Dewilde,Serena Iacovo,Liesbeth Witters,Tomas Webers, Koen Van Sever,Joeri De Vos,Andy Miller,Gerald Beyer, Eric Beyne
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.312-318, (2024)
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Manufacturability of microLED on CMOS for Augmented Reality Glasses
Soeren Steudel Steudel, Johan Vertommen, Emmanuel Le Boulbar, Giuseppe Buscemi, Lars Bach,Stefaan Van Huylenbroeck, Shuo Kang,Joeri De Vos,Andy Miller, Haris Osman,Kenneth June Rebibis
Proceedings of the International Display Workshops (2023)
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4‐3: MircoLED display on 300mm CMOS platform – crosstalk and optical outcoupling
Soeren Steudel, Johan Vertommen, Emmanuel Le Boulbar, Giuseppe Buscemi, Lars A. Bach,Stefaan Van Huylenbroeck, Shuo Kang,Joeri De Vos,Andy Miller, Haris Osman,Kenneth June Rebibis
SID Symposium Digest of Technical Papersno. 1 (2023): 25-28
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Dielectric Breakdown of Low Temperature Deposited SiCN Layers
Lin Hou, Venkat Sunil Kumar Channam,Alicja Lesniewska, Serena Lacovo, Shuo Kang,Joeri De Vos,Anne Jourdain,Gerald Beyer,Kristof Croes,Edward Walsby,Kath Crook, Igor Belov,
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials (2023)
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57‐3: MircoLED Display Integration on 300mm Advanced CMOS Platform
Soeren Steudel, Johan Vertommen, Emmanuel Le Boulbar, Giuseppe Buscemi, Lars Bach,Stefaan Van Huylenbroeck, Hariharan Arumugam,Douglas Charles La Tulipe,Joeri De Vos,Andy Miller, Haris Osman,Kenneth June Rebibis
SID Symposium Digest of Technical Papersno. 1 (2022): 748-751
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