基本信息
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Bio
Jin Young Kim received the M.S. and Ph.D. degrees in mechanics from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea, in 1993 and 2002, respectively.
He is currently the Director of the Package Characterization Group at Amkor Technology, Inc., Seoul, Korea, and he is working on the development of new techniques and materials for the high-performance, high-reliability system-level packages.
Research Interests
Papers共 18 篇Author StatisticsCo-AuthorSimilar Experts
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (2022)
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Author Statistics
#Papers: 18
#Citation: 252
H-Index: 8
G-Index: 14
Sociability: 4
Diversity: 1
Activity: 0
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