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Research Interests

Papers共 72 篇Author StatisticsCo-AuthorSimilar Experts

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Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package
Joo Young Bae,Mi-Song Kim, So-Hee Hyun,Jong-Hyun Lee,Jeong Tak Moon,Young-Woo Lee, Seul Gi Lee, Hyeong-Tea Kim, Seung-Kwan Baek,Won Sik Hong
Journal of Welding and Joiningno. 2 (2024): 174-183
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Improved Cycle Properties of All-Solid-State Li-Ion Batteries with Al2O3 Coating on the Silicon-Based Anode
Jejun Jeong, Kikang Lee, Cole Carpenter, Sushovan Shrestha,Jongbeom Kim,Hee-Suk Chung,Jeongtak Moon,Kyu Hwan Oh, Jeong-Yun Sun,Se-Hee Lee
Journal of Energy Engineeringno. 2 (2024)
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Insulated, Passivated & Adhesively-Promoted Bond Wire Using All-in-One Al2O3 Coating
Soojae Park, Jonghyun Lee, Chulhyung Cho, Nam Hoon Kim,Yongje Lee, Sichun Seo, Manho Kim,Youngkwon Yoon, Eulgi Min, Kyujung Choi, Sanghoon Lee, Hong-Sik Nam,
IMAPS symposia and conferencesno. Issue 1 (2023)
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Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
Joo Young Bae,Mi-Song Kim,Hye Min Lee, Seulgi Lee,Young-Woo Lee,Jeong Tak Moon,Won Sik Hong
Journal of welding and joining (Online)no. 5 (2023): 379-386
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High reliability performance of Ag-cored Au coated wire capable of bonding in gas free condition
Sung-Min Jeon,Sang-Yeob Kim, Sung-Young Lee,Hyun-Jun Park, Mi-Rang Ra, Mong-Hyun Cho,Jeong-Tak Moon
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.503-508, (2022)
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Author Statistics

#Papers: 72

#Citation: 1005

H-Index: 23

G-Index: 29

Sociability: 5

Diversity: 2

Activity: 5

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