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Jean-Charles Souriau (M'04–SM'06) received the Ph.D. degree in physics from the University of Grenoble, Grenoble, France, in 1993.
He joined the Electronics and Information Technology Laboratory, French Atomic Energy Commission, Micro and Nanotechnologies Campus, Grenoble, in 1994, to work on reliability enhancement of flat panel display based on microtips field emission. From 1997 to 1998, he was a Visiting Scientist at the Georgia Institute of Technology, Atlanta, in charge of the development of phosphors which are adapted for field emission display operation. He is now a Project Leader in the field of micro-interconnection and packaging since more than 10 years. He has managed different projects such as the development of new anisotropic conductive film for high density flip-chip interconnection, the packaging in optical transceivers, and the wafer level packaging. He is the first author of several publications and more than 10 patents in the field of microelectronic packaging, micro systems technologies, and 3-D integrations.
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论文共 63 篇作者统计合作学者相似作者
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)no. EMPC (2023): 1-4
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 7 (2023): 913-919
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)no. EMPC (2023): 1-6
Fabrice Casset, Munique Kazar Mendes,Nadine David,Rémi Franiatte, Daniel Mermin,Marc Zussy,Jérôme Dechamp,Laetitia Castagné,Jean-Charles Souriau, Kevin Benedetto,Mikael Colin
2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)pp.887-890, (2023)
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Perceval Coudrain,Arnaud Garnier,Laetitia Castagné,Aurélia Plihon,Rémi Vélard,Rémi Franiatte,Jean-Charles Souriau, Jeanne Pignol, Célia Darrambide, Emmanuel Ollier
ECS Transactionsno. 2 (2022): 3-14
2021 SMART SYSTEMS INTEGRATION (SSI)pp.1-4, (2021)
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