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个人简介
Jean Charbonnier (Member, IEEE) is graduated from the National School of Physics of Grenoble, Grenoble, France, in 2001 and received the Ph.D. degree in crystallography from the University Joseph Fourier, Grenoble, in 2006.
He joined the 3D Wafer Level Packaging Group, CEA-Leti, Grenoble, in 2008. He has been working for more than ten years in through silicon vias, 3D interconnections, and silicon interposers technology. His research interests include high-performance computing, silicon photonics interposer, as well as cryopackaging for quantum architecture applications. He is currently in charge of coordinating the High-Density 3D Integration Group, 3D Packaging Laboratory, CEA-Leti.
研究兴趣
论文共 57 篇作者统计合作学者相似作者
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Harold Le Tulzo, Diane Bijou, Thérèse Souza, Anthony Gallegos,Candice Thomas,Edouard Deschaseaux,Céline Feautrier,Jean Charbonnier,Alain Gueugnot,Jaber Derakhshandeh, Tassawar Hussain,Jérôme Daviot
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.378-385, (2024)
Pablo Renaud, Christophe Dubarry,Nicolas Bresson,Edouard Deschaseaux,Frank Fournel,Christophe Morales,Karine Abadie,Candice Thomas,Jean Charbonnier
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.441-446, (2024)
Candice Thomas,Edouard Deschaseaux,Rémi Vélard, Giovanni Romano,Jean-Philippe Michel, Norman Vivien,Richard Souil, Cassandre Beluffi, Simon Guignard, Catherine Pellissier,Jean Charbonnier
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.809-815, (2024)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.973-979, (2023)
Damien Saint-Patrice,Stephane Malhouitre,Myriam Assous, Thierry Pellerin,Remi Velard,Leopold Virot,Edouard Deschaseaux, Maria-Luisa Calvo-Munoz,Karim Hassan,Stephane Bernabe,Yvain Thonnart,Jean Charbonnier
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.5-12, (2023)
Harold Le Tulzo, Loriana Celeste, Ines Tendero,Jaber Derakhshandeh,Carine Gerets,Candice Thomas,Jean Charbonnier,Edouard Deschaseaux, Thierry Lazerand,Jerome Daviot
ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC)pp.157-160, (2023)
Mohamed Rayane Bani,Romain Crochemore, Floriane Baudin, Cassandre Beluffi, Catherine Euvrard-Colnat, Sebastien Dominguez,Guillaume Rodriguez,Richard Souil,Remi Velard,Jean Charbonnier,Edouard Deschaseaux,Candice Thomas
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)pp.354-358, (2022)
Candice Thomas,Jean-Philippe Michel,Edouard Deschaseaux,Jean Charbonnier,Richard Souil, Elisa Vermande, Alain Campo, Thierry Farjot,Guillaume Rodriguez, Giovanni Romano,Frédéric Gustavo,Baptiste Jadot,
Materials for Quantum Technologyno. 3 (2022): 035001-035001
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